BGA Reballing Station HT-90 Diagonal Universal Stencil Solder Aluminum Alloy Rework Reballing Kit for Laptop CPU Mobile Phone Rework for Large Steel Mesh 9mm-43mm

BGA Reballing Station HT-90 Diagonal Universal Stencil Solder Aluminum Alloy Rework Reballing Kit for Laptop CPU Mobile Phone Rework for Large Steel Mesh 9mm-43mm

Name: BGA Reballing Station HT-90 Diagonal Universal Stencil Solder Aluminum Alloy Rework Reballing Kit for Laptop CPU Mobile Phone Rework for Large Steel
Brand: Walfront
Price: 167.70 EUR
Availability: InStock
Rating: 4.7 (1 reviews)

4.7/5

Produkt-ID: 558676179

Sichere Transaktion

🔄Adjustable diversion groove for excess solder

⚙️Precision fit for 9-43mm BGA chips

🛡️Durable aluminum alloy frame

Häufig zusammen gekauft

BGA Reballing Station HT-90 Diagonal Universal Stencil Solder Aluminum Alloy Rework Reballing Kit for Laptop CPU Mobile Phone Rework for Large Steel Mesh 9mm-43mm

Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls Reball Ball BGA Ball Reballing Ball for GPU CPU IC Chip PCB Used for Connection of semiconductor chip (9 Bottles 0.3mm-0.76mm)

Walfront 130PCS Universal Reballing Stencils, Stainless Steel Mesh, Directly Heat Set, Rework Net, Phone Repair Tools, 6 Sizes, 130 Pieces, Laptop, Desktop, Graphics Card

Beschreibung

⚡ Reball like a pro—precision, durability, and control in one sleek kit!

PRECISION BALL PLANTING - Diagonal fixture guarantees accurate solder ball placement for flawless reballing results every time.
UNIVERSAL COMPATIBILITY - Fits a wide range of BGA chips from 9mm to 43mm, perfect for diverse laptop and mobile CPU repairs.
EFFORTLESS SOLDER MANAGEMENT - Innovative diversion groove design channels excess solder beads away, minimizing mess and rework time.
PREMIUM ALUMINUM ALLOY BUILD - Lightweight yet robust structure resists oxidation and wear, ensuring long-lasting performance.
PROFESSIONAL GRADE REWORK KIT - Ideal for manual BGA soldering on laptops, smartphones, and digital devices—upgrade your repair game.

The BGA Reballing Station HT-90 features a high-quality aluminum alloy frame designed for durability and oxidation resistance. It supports BGA chips ranging from 9mm to 43mm with a universal diagonal ball planting fixture. The adjustable diversion groove efficiently manages excess solder beads, making it an essential tool for precise manual reballing on laptops, mobile phones, and other digital devices.