REVOLUTIONARY 6 IN 1 DESIGN - Streamline your reballing process with multiple chip compatibility.
DURABLE STAINLESS STEEL CONSTRUCTION - Built to last, ensuring reliability in every reballing session.
The BGA Stencils Kit is a versatile 6-in-1 solution designed for efficient reballing of various BGA ICs, featuring a unique heat dissipation design and made from high-quality stainless steel for durability and precision.
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