ROBUST FLEXIBLE - Designed to withstand the rigors of development.
COMPACT LIGHTWEIGHT - Perfect fit for your development board without bulk.
THERMAL PASTE INCLUDED - Maximize performance right out of the box!
EFFORTLESS INSTALLATION - Assemble in seconds with no tools required!
SUPERIOR HEAT DISSIPATION - Keep your NanoPi cool under pressure.
The NanoPi NEO/NEO Air/NEO 2/Core/Core2/NEO Plus2 Aluminum Heat Sink is engineered for optimal thermal management of your development board. Its compact design ensures easy assembly and effective heat dissipation, making it an essential accessory for any tech enthusiast.
Spezifikationen
Item Weight
0.07 Pounds
Mounting Type
Wall Mount
CPU Socket
BGA
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Sneha T.
Habe mein Produkt in makellosem Zustand erhalten. Insgesamt toller Service.
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Ali H.
Schneller Versand und hervorragende Verpackung. Das Leatherman-Tool fühlt sich sehr wertig und stabil an.