HEAT RESILIENCE - Withstands high temperatures without deformation, ensuring reliable results.
COMPREHENSIVE SET - Includes 130 pieces across 6 sizes, catering to every project requirement.
USER FRIENDLY DESIGN - Specifications clearly marked for quick and easy size selection.
PRECISION ENGINEERING - Crafted from high-quality stainless steel for durability and performance.
VERSATILE COMPATIBILITY - Designed for laptops, desktops, and various BGA chips—perfect for all your reballing needs.
The Focket BGA Rework Net is a comprehensive set of 130 high-quality stainless steel stencils designed for reballing BGA chips in laptops, desktops, and communication boards. With 6 different sizes and heat-resistant properties, these stencils ensure precision and durability, making them an essential tool for any tech repair professional.
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