HY-710-20g Thermal Paste;Heatsink Paste;Thermal Conductivity:>3.14W/m-k Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers, Thermal Interface Material - 20 Gram
4.4/5
Produkt-ID: 112703195
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Beschreibung
BETTER THAN LIQUID METAL: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
Suitable for: CPU heatsink or chip. High temperature resistance.
low thermal resistance and high conductivity for superior heat transfer. .Apply to CPU,VGA,chipset and other PC components.
High stability and reliability. Helps disperse the heat from CPU to heatsink effectively.
Warranty and Service: Our products are covered by the guarantee. If you have questions, please contact us in time. We will answer your questions promptly within 16 hours.
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Markus S.
Mir hat die Produktvielfalt sehr gefallen. Werde auf jeden Fall wieder hier einkaufen.
vor 2 Monaten
Abdullah B.
Toller Preis für ein authentisches Produkt. Auch schneller internationaler Versand!
